1. Application
1.1 H-802 is Dual cure water&solvent-resistant photo emulsion.
1.2 It is Suitable for printing lines and texts with high viscosity on LCD frame, PCB, FPC. Printing pattern is clear and full.
1.3 Excellent perfomance for printing PCB carbon oil, silver paste, and thick film PCB stencils.
1.4 High precision printing.
2. Characteristics
Appearance | Specification | Weight of emulsion | Viscosity | Solid Content | Diazo |
Viscous white liquid | 1kg/can | 900g | 11500 | 43% | H-802 6.0g |
3. Features
3.1 Conform to the European Union RoHS instruction 2.0 standard (European Union RoHS directive 2011/65 / EU) and European Union 6 p certification standards (European Union directive 2005/84 / EC).
3.2 Excellent water&solvent resistant.
3.3 High sensitivity and short exposure time.
3.4 It has high resolution. The smooth edge can print fine lines.
3.5 High speed of development, easy cleaning, good performance of picture representation.
3.6 Hard film, can make thick film stencils.
4. Exposure Time
Screen Mesh |
Angle |
Thickness |
Lamp | Lamp Distance | Best Exposure Time |
250T(Y) |
22.5° |
15±1μm | Extra-high-pressure mercury vapor lamp 3KW |
1m |
180sec |
Second exposure after development can improve the printing life.
5. Usage
Photosensitization: Fully dissolve Photosensitizer-DIAZO in 70-100g water. Then put the dissolved Diazo into emulsion paste, fully stiring by glass or wooden bar. Please use it after it finished antifoaming.
Coating:Please use high quality scraper. Coating properties closely related to the size and tension of the mask. The printed materials affect coating times and the film thickness very much.For two more coating, please coat again when the former coating dry completely in case the film falls off. The drying temperature must be controlled below 40°C. The higher temperature will produce thermal reaction and affect the plate-making effects.
Exposure: The best light wave is 300-400 nm, the extra-high-pressure mercury vapor lamp and High iodine gallium lamp is the best choice.
Development: Please use water cannon and spray gun flush the mask uniformly.
Dry:Remove the mask surface’s moisture after development. Then dry it in the dry oven under 40°C. The mask should be dried completely otherwise the glue will fall.
Second Exposure: The printing plate rate can be improved if ensure the S side exposure time is 1-2 times of the P side.
Hardening: After the mask completely dry, coat the A+B hardener on the P and S sides uniformly and use air gun to blow through the ink area after 1-2 minutes and dry 20-30 minutes. The above operating can significantly improve the printing life.
6. Precautions
Storage of Emulsion:
Store the emulsion (without diazo) in dark place at 20°C and do not store it at more than 25℃ or lower the 5℃. Storing Diazo in refrigerator at 0-5℃.
Screen Degreasing:
Please use professional screen degreaser to wash the mask and remove oil and dust before coating.
Diazo Dissolution:
Use pure water to dissolve diazo rather than tap water, because the mineral substanc and water rust in it can react with emulsion and affect the emulsion’s performance. What is the worst is the paste will clotting and the emulsion can not be used.
Temperature of the oven:
Control the oven temperature below 40°C .The resolution will decrease if more than 40°C. The dry oven should have exhaust device so that the moisture can be discharged and the dry efficiency can be improved. Check monthly weather inside temperature is consistent with the setting temperature.
Development in Winter:
Use warm water (25°C) to develop. The low temperature water in winter may cause bad development and decreasing of resolution.
Copyright DENBISHI Intelligent Technology (Kunshan) Co., Ltd.